- Timeline: Completed in November 2024 within an intensive 3-week timeframe
- Software Used: SolidWorks for CAD modeling and assembly structuring
- Assembly Scale: Modeled approximately 320 individual parts, achieving a fully detailed and structured digital assembly
- Component Accuracy: All parts modeled from scratch except processor brackets, which were imported as STL files
- Reference Method: Conducted without official dimensions, relied on assumption-based scaling while maintaining a high-fidelity output as the primary objective
- Modeling Approach: Applied reverse engineering techniques to capture intricate geometries, ensuring consistency across components
- Complexity Managed: Organized and integrated hundreds of sub-components, showcasing advanced assembly management skills
- Attention to Detail: Accurately represented connectors, slots, and chip housings with fine detailing to replicate real-world hardware
- Technical Challenge: Balanced computational performance with model complexity by optimizing features without compromising accuracy
- Outcome: Produced a high-resolution motherboard model suitable for educational demonstrations, visualization, and design references
- Value: Serves as a benchmark project highlighting precision CAD modeling, scalability in handling large assemblies, and resourceful problem-solving under incomplete data conditions