Developed a conjugate heat-transfer model of an air-cooled heat sink for a 25 W chip in ANSYS Icepak to study thermal–fluid behavior and design tradeoffs. Applied response surface optimization to explore the influence of fin geometry parameters such...
Led the development of an advanced robotic automation system designed to achieve +/- 25 micron precision in manufacturing processes. Key functionalities included the precise dispensing of UV adhesive, high-accuracy part alignment facilitated by...