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Optothermal Bubble Etch Lithography (OBEL) Research

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Pradyota Phaneesh

OVERVIEW

This research project advanced sustainable nanomanufacturing by developing and optimizing Optothermal Bubble Etch Lithography (OBEL), a maskless subtractive technique for high-precision device fabrication. The work focused on laser-induced microbubble formation on gold thin films to achieve localized, spatially selective etching while minimizing chemical waste and thermal damage. Through extensive experimental optimization, the research demonstrated submicron feature resolution (~450nm) using ultralow etchant concentrations, establishing OBEL as an environmentally friendly and cost-effective alternative to conventional lithography methods.

HighlightS

Over 1.5 years, conducted 200+ controlled experiments to systematically investigate the relationship between laser parameters, etchant chemistry, and etching precision. Leveraged solutal Marangoni convection phenomena to actively remove bubbles and reaction byproducts, producing clean, sharply defined nanoscale features. The optimized process achieved breakthrough results in feature resolution while dramatically reducing chemical consumption compared to traditional photolithography. Findings were documented, co-authored for publication, and presented at the prestigious Optical Trapping and Optical Micromanipulation XXII conference, with applications spanning electronics, photonics, and biomedical device manufacturing.

SKILLS

Research and Experimental DesignNanomanufacturingLabVIEWOptical and Laser SystemsScientific CommunicationProblem SolvingProject Management
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Pradyota Phaneesh

Mechanical Engineering & Advanced Manufacturing

Mechanical engineer with expertise in advanced manufacturing, CAD design, and finite element analysis. Experienced in optimizing production processes, designing complex mechanical systems, and conducting experimental research in sustainable nanomanufacturing. Proficient in ANSYS, MATLAB, and industry-standard CAD tools. Demonstrated ability to reduce manufacturing defects, improve first-pass yield, and lead cross-functional engineering teams.

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