A BGA SoC reballing JIG is a specialized set of equipment used to replace the tiny solder balls on the underside of a System-on-a-Chip (SoC) that uses a Ball Grid Array (BGA) package. Key Design Components A functional reballing jig typically consists of four main parts: • Base Plate: A flat heavy foundation that prevents movement during the process. • Clamping System: Adjustable side-clamps controlled by screws to hold the SoC flat and centered on all four sides. • Stencil Holder • Height Adjusters.