Designing a mini wave soldering pallet, used in selective soldering/Desoldering of PCB components This pallet is machined from high-Key Design Considerations for Mini Wave Pallets Key Design Consideration -Material Selection -PCB Support & Protection: -Component Masking: Precisely machined pockets...

A BGA SoC reballing JIG is a specialized set of equipment used to replace the tiny solder balls on the underside of a System-on-a-Chip (SoC) that uses a Ball Grid Array (BGA) package. Key Design Components A functional reballing jig typically consists of four main parts: • Base Plate: A flat heavy ...