Mobile VR Deployment System

Mobile VR Deployment System

Designed and iterated a modular mobile enclosure to house and deploy a full VR classroom server stack, including UPS, PDU, networking hardware, and headset storage. The system integrates structural rigidity, thermal management, secure access control, and flat-pack manufacturability for scalable depl...
Mechanical DesignStructural Frame Design Electromechanical IntegrationDFMTolerance AnalysisHardware PackagingThermal ManagementLaser Tube CuttingWater Jet FabricationWelded AssembliesAssembly Optimization
Expandable Mobile Immersive Classroom

Expandable Mobile Immersive Classroom

Led mechanical integration of a mobile trailer-based immersive classroom containing a fully integrated 16-seat VR system. The platform features expandable sidewalls, integrated server infrastructure, and distributed power and data to each student workstation, enabling rapid deployment of a complete ...
System-Level Mechanical IntegrationDeployable StructuresInfrastructure PackagingPower & Data DistributionSpatial OptimizationCross-Disciplinary IntegrationMobile Platform DesignProduction Deployment
Integrated Power & Data Distribution Module

Integrated Power & Data Distribution Module

Designed a compact steel sheet-metal enclosure housing all power, audio, and network infrastructure required to support individual student desks in immersive classroom environments. The system integrates multiple electrical subsystems into a thermally managed, manufacturable form factor optimized fo...
Sheet Metal DesignHardware PackagingElectromechanical IntegrationPower DistributionThermal ManagementDFMInstallation OptimizationAssembly Workflow Design
Infrared-Tracked Interactive Wand

Infrared-Tracked Interactive Wand

Designed a wand-shaped interactive device for a Harry Potter VR experience, utilizing infrared LED tracking for positional detection. The device integrates a custom PCB within an injection-molded housing, optimized for durability, repeatable tracking performance, and scalable production.
Electromechanical IntegrationPCB PackagingInjection Mold DesignIR Tracking SystemsConsumer Hardware DesignTolerance ManagementProduct DevelopmentCross-Functional Collaboration