
Microprocessor Pin-Fin Heat Sink Thermal CFD & UDF Modeling
Conducted a 3D conjugate heat transfer CFD simulation in ANSYS Fluent to design and optimize a 10x10 pin-fin heat sink for high-power electronics cooling. The study evaluated fin efficiency, thermal resistance, and convective dissipation to maintain peak chip operating temperatures below 75°C…
ANSYS FluentC Programming for ANSYS UDFs3D Conjugate Heat Transfer (CHT) & Convection ModelingElectronics Thermal Management & Hotspot MitigationAnalytical Extended Surface (Fin) Efficiency Validation



