Formula SAE Electronics Packaging Subsystem Lead
I led the design and manufacture of robust electronics packaging for a Formula SAE vehicle operating in high-vibration, thermal, and shock environments. The project focused on lightweight, impact-resistant enclosures that balanced durability, thermal performance, and serviceability within tight pack...
Siemens NXElectronics packagingThermal managementVibration isolationFDM 3D printingCarbon-nylon compositesCAD modelingSystems integrationMATLAB