- Timeline: Completed in November 2024 within an intensive 3-week timeframe
- Software Used: SolidWorks for CAD modeling and assembly structuring
- Assembly Scale: Modeled approximately 320 individual parts, achieving a fully detailed and structured digital assembly
- Component Accuracy: All parts modeled from scratch except processor brackets, which were imported as STL files
- Reference Method: Conducted without official dimensions, relied on assumption-based scaling while maintaining a high-fidelity output as the primary objective
- Modeling Approach: Applied reverse engineering techniques to capture intricate geometries, ensuring consistency across components
- Complexity Managed: Organized and integrated hundreds of sub-components, showcasing advanced assembly management skills
- Attention to Detail: Accurately represented connectors, slots, and chip housings with fine detailing to replicate real-world hardware
- Technical Challenge: Balanced computational performance with model complexity by optimizing features without compromising accuracy
- Outcome: Produced a high-resolution motherboard model suitable for educational demonstrations, visualization, and design references
- Value: Serves as a benchmark project highlighting precision CAD modeling, scalability in handling large assemblies, and resourceful problem-solving under incomplete data conditions
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High-Fidelity CAD Model of ASUS Motherboard
Project Timeline
Nov 2024 - Nov-2024
OVERVIEW
This project involved the complete reverse engineering and 3D modeling of an ASUS motherboard, capturing every component from connectors and slots to microchip housings with meticulous accuracy. The objective was to demonstrate proficiency in precision CAD modeling, assembly structuring, and component detailing. Beyond replicating the geometry, the project emphasized scalability of complex assemblies, design documentation, and visualization for potential applications in product design, hardware integration, and educational demonstrations. The work reflects my ability to manage intricate designs while maintaining consistency, manufacturability considerations, and a high level of technical detail.
HighlightS
- Created a complete high-fidelity 3D model of an ASUS motherboard
- Independently modeled all components, excluding processor brackets sourced externally
- Delivered a fully structured and detailed multi-component assembly
SKILLS
SolidWorksPrecision CAD ModelingReverse EngineeringComplex Assembly Management
SUPPORTING MATERIALS
Additional Details
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